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BL5500 Series

Baubly - Laser Decap - BL5500
  • For IC decapsulation
  • Two independent high resolution Ethernet cameras with 5Mp

Features

  • The entire process is 100% controllable by the operator, allowing one to determine the precise depth, location, and geometry of the ablation area through our User Interface.
  • Real time color vision system provides a continuous control of the ablation process.
  • Three fully CNC controlled axes and two 5Mp independent high resolution Ethernet cameras ensure the precise positioning.
  • Integrated red laser pointer for comfortable adjustment and positioning of the work piece.
  • No destruction of wires during opening
  • Laser class one safety cabinet, no additional cost for laser protection.

Application

  • Semiconductor failure analysis; IC decapsulation and removing large filler mold compounds, such as revoe resin and plastics; Expose Wire Bonds

 

Specifications

Laser type

Ytterbium fiber laser

Wavelength

1064 nm

Pulse repetition frequency

1.6 kHz – 1 MHz

Beam Diameter

 Less than 60um

Power

20 W

Inscription area

max. 300 x 300 mm

Control

CNC control

System software

Windows 7

Measurements

1493 x 860 x 1777 mm (L x W x H)

Network connection

Yes


 

Materials

Material

Engrave

Stainless

√

Coated Metals

√

Brass

√

Copper

√

Gold

√

Silver

√

Titanium

√

Bare Metals

√

Ruber

√

PP

√

PS

√

PP

√

ABS

√

PVC

√

PE

√

Crystal

√

Ceramic

√

Diamond

√

Gemstone

√

Cloth

√

Leather

√

Fiber

√

Carbon Fiber

√


Laser Ablation


 Inquiry - BL5500 Series