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We don’t break die
 The OmegaPrep II was designed to perform in package die thinning and polishing in addition to a number of machining functions for sample preparation. The die thinned and polished by the OmegaPrep are compatible with all backside procedures such as IR emission microscopy and FIB edit.
 The OmegaPrep II was designed to perform in package die thinning and polishing in addition to a number of machining functions for sample preparation. The die thinned and polished by the OmegaPrep are compatible with all backside procedures such as IR emission microscopy and FIB edit.
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Baubly - Laser Decap - BL5500
- For IC decapsulation
- Two independent high resolution Ethernet cameras with 5Mp
Features
- The entire process is 100% controllable by the operator, allowing one to determine the precise
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The Elite Etch is our first-generation automated mixed acid decapsulator. With advanced features, this decapsulator rapidly and easily opens a wide range of delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or mixed acids to the sample package.
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We don’t break die
 LARGE DIE BACKSIDE THINNING WITH MINIMAL THICKNESS VARIATION
 UltraPrep IV is designed to perform in-package die thinning and polishing, along with special machining functions for sample preparation.
 LARGE DIE BACKSIDE THINNING WITH MINIMAL THICKNESS VARIATION
 UltraPrep IV is designed to perform in-package die thinning and polishing, along with special machining functions for sample preparation.
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Baubly - Laser Decap - BL2500
- Two independent high resolution Ethernet cameras with 5Mp
- Processing area- 110 x 110 mm
Features
- Tabletop style, small, movable and compact
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The Elite Etch Cu from RKD Engineering is an automated mixed acid decapsulator which enables high productivity through the integration of advanced features. This decapsulator rapidly opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or mixed acids to the sample package.
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The Elite Etch Cu ESD from RKD Engineering is an automated mixed acid decapsulator which enables high productivity through the integration of advanced features. This decapsulator rapidly opens delicate integrated circuit packages by delivering precise, micro-aliquots of nitric, sulfuric, or mixed acids to a sample surface.
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The Mega Etch was designed with the PCB manufacturer in mind. This system gives an engineer the ability to open IC packages which are still attached to the original printed circuit board. This process enables the IC to maintain electrical functionality and system state even after an operation has been performed.
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The I53 Injector is used to introduce low volumes of a solution into the acid stream of Elite Etch decapsulators. This solution is designed to create a more effective etching process and to prevent metal loss with samples that have silver alloy wires. The system is compatible with other custom corrosion inhibitors which can be formulated for other wire systems.
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