Decapsulator

We don’t break die
  The OmegaPrep was designed to perform in package die thinning and polishing in addition to a  number of machining functions for sample preparation. The die thinned and polished by the OmegaPrep are compatible with all backside procedures such as IR emission microscopy and FIB edit.

We don’t break die
  LARGE DIE BACKSIDE THINNING WITH MINIMAL THICKNESS VARIATION
  UltraPrep III is designed to perform in-package die thinning and polishing, along with special machining functions for sample preparation.

The Elite Etch Cu from RKD Engineering is an automated mixed acid decapsulator which enables high productivity through the integration of advanced features. This decapsulator rapidly opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or mixed acids to the sample package.

The Elite Etch Cu ESD from RKD Engineering is an automated mixed acid decapsulator which enables high productivity through the integration of advanced features. This decapsulator rapidly opens delicate integrated circuit packages by delivering precise, micro-aliquots of nitric, sulfuric, or mixed acids to a sample surface.