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We don’t break die
The OmegaPrep II was designed to perform in package die thinning and polishing in addition to a number of machining functions for sample preparation. The die thinned and polished by the OmegaPrep are compatible with all backside procedures such as IR emission microscopy and FIB edit.
The OmegaPrep II was designed to perform in package die thinning and polishing in addition to a number of machining functions for sample preparation. The die thinned and polished by the OmegaPrep are compatible with all backside procedures such as IR emission microscopy and FIB edit.
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