Thinning Machine
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We don’t break die
The OmegaPrep II was designed to perform in package die thinning and polishing in addition to a number of machining functions for sample preparation. The die thinned and polished by the OmegaPrep are compatible with all backside procedures such as IR emission microscopy and FIB edit.
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We don’t break die
LARGE DIE BACKSIDE THINNING WITH MINIMAL THICKNESS VARIATION
UltraPrep IV is designed to perform in-package die thinning and polishing, along with special machining functions for sample preparation.
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