Mechanical Decap, Milling Machine
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LARGE DIE BACKSIDE THINNING WITH MINIMAL THICKNESS VARIATION
UltraPrep IV is designed to perform in-package die thinning and polishing, along with special machining functions for sample preparation.
LARGE DIE BACKSIDE THINNING WITH MINIMAL THICKNESS VARIATION
UltraPrep IV is designed to perform in-package die thinning and polishing, along with special machining functions for sample preparation.
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The RKD Nano Mill II 5100 is designed to make custom fitted gaskets and fixtures for use with RKD Engineering decapsulators. It also performs mechanical decapsulation and heat spreader removal in preparation for wet etching. The system is an easy to use solution for quick turn decapsulator tooling and sample preparation.
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