Mechanical Decap
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We don’t break die
The OmegaPrep was designed to perform in package die thinning and polishing in addition to a number of machining functions for sample preparation. The die thinned and polished by the OmegaPrep are compatible with all backside procedures such as IR emission microscopy and FIB edit.
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We don’t break die
LARGE DIE BACKSIDE THINNING WITH MINIMAL THICKNESS VARIATION
UltraPrep III is designed to perform in-package die thinning and polishing, along with special machining functions for sample preparation.
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The RKD Nano Mill II 5100 is designed to make custom fitted gaskets and fixtures for use with RKD Engineering decapsulators. It also performs mechanical decapsulation and heat spreader removal in preparation for wet etching. The system is an easy to use solution for quick turn decapsulator tooling and sample preparation.
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